Granted Patent
Utility
US 6,025,265 · App. 08/989,953
Method of forming a landing pad structure in an integrated circuit
Inventors:
Robert O. Miller, Gregory C. Smith
Patented Case
View Patent ↗
Granted: Feb 15, 2000
Filed: Dec 12, 1997
Inventors
Robert O. Miller
Gregory C. Smith
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.