Granted Patent
Utility
US 6,027,860 · App. 09/103,202
Method for forming a structure using redeposition of etchable layer
Inventors:
Brent A. McClure, Daryl C. New
Patented Case
View Patent ↗
Granted: Feb 22, 2000
Filed: Jun 23, 1998
Inventors
Brent A. McClure
Daryl C. New
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.