IP Library › Granted Patent US 6,027,979
Granted Patent Utility
US 6,027,979 · App. 09/073,417

Method of forming an integrated circuit device

Inventor: Che-Chia Wei
Patented Case View Patent ↗
Granted: Feb 22, 2000 Filed: May 6, 1998
Inventor
Che-Chia Wei
Assignee (at issue)
STMICROELECTRONICS, INC.

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Quick Facts
Patent No.
US 6,027,979
App. No.
09/073,417
Filed
1998-05-06
Granted
2000-02-22
Kind
A