Granted Patent
Utility
US 6,033,980 · App. 08/978,382
Method of forming submicron contacts and vias in an integrated circuit
Inventors:
Fu-Tai Liou, Mehdi Zamanian
Patented Case
View Patent ↗
Granted: Mar 7, 2000
Filed: Nov 25, 1997
Inventors
Fu-Tai Liou
Mehdi Zamanian
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.