Granted Patent
Utility
US 6,059,168 · App. 09/048,543
Wire bond apparatus and method thereof
Inventors:
Young Joo Shin, Su-gun Nam
Patented Case
View Patent ↗
Granted: May 9, 2000
Filed: Mar 26, 1998
Inventors
Young Joo Shin
Su-gun Nam
Assignee (at issue)
Samsung Aerospace Industries, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.