IP Library › Granted Patent US 6,061,251
Granted Patent Utility
US 6,061,251 · App. 08/925,423

Lead-frame based vertical interconnect package

Inventors: Brian R. Hutchison, Peter J. Walters
Patented Case View Patent ↗
Granted: May 9, 2000 Filed: Sep 8, 1997
Inventors
Brian R. Hutchison
Peter J. Walters
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 6,061,251
App. No.
08/925,423
Filed
1997-09-08
Granted
2000-05-09
Kind
A