Granted Patent
Utility
US 6,062,461 · App. 09/116,815
Process for bonding micromachined wafers using solder
Inventors:
Douglas Ray Sparks, Larry L. Jordan, Ruth Ellen Beni, Anthony Alan Duffer, Shing Yeh
Patented Case
View Patent ↗
Granted: May 16, 2000
Filed: Jun 3, 1998
Inventors
Douglas Ray Sparks
Larry L. Jordan
Ruth Ellen Beni
Anthony Alan Duffer
Shing Yeh
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.