Granted Patent
Utility
US 6,077,767 · App. 09/389,823
Modified implementation of air-gap low-K dielectric for unlanded via
Inventor:
Tsing-Fong Hwang
Patented Case
View Patent ↗
Granted: Jun 20, 2000
Filed: Sep 3, 1999
Inventor
Tsing-Fong Hwang
Assignees (at issue)
United Semiconductor Corp.
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.