Granted Patent
Utility
US 6,080,670 · App. 09/131,921
Method of detecting a polishing endpoint layer of a semiconductor wafer which includes a non-reactive reporting specie
Inventors:
Gayle W. Miller, Gail D. Shelton, Brynne K. Chisholm
Patented Case
View Patent ↗
Granted: Jun 27, 2000
Filed: Aug 10, 1998
Inventors
Gayle W. Miller
Gail D. Shelton
Brynne K. Chisholm
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.