Granted Patent
Utility
US 6,090,687 · App. 09/124,311
System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein
Inventors:
Paul Merchant, Storrs T. Hoen
Patented Case
View Patent ↗
Granted: Jul 18, 2000
Filed: Jul 29, 1998
Inventors
Paul Merchant
Storrs T. Hoen
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.