Granted Patent
Utility
US 6,107,180 · App. 09/015,956
Method for forming interconnect bumps on a semiconductor die
Inventors:
Robert A. Munroe, Stuart E. Greer
Patented Case
View Patent ↗
Granted: Aug 22, 2000
Filed: Jan 30, 1998
Inventors
Robert A. Munroe
Stuart E. Greer
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.