Granted Patent
Utility
US 6,108,092 · App. 09/328,034
Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
Inventor:
Gurtej S. Sandhu
Patented Case
View Patent ↗
Granted: Aug 22, 2000
Filed: Jun 8, 1999
Inventor
Gurtej S. Sandhu
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.