Granted Patent
Utility
US 6,111,319 · App. 08/575,691
Method of forming submicron contacts and vias in an integrated circuit
Inventors:
Fu-Tai Liou, Mehdi Zamanian
Patented Case
View Patent ↗
Granted: Aug 29, 2000
Filed: Dec 19, 1995
Inventors
Fu-Tai Liou
Mehdi Zamanian
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.