Granted Patent
Utility
US 6,113,399 · App. 09/099,054
Low-profile socketed packaging system with land-grid array and thermally conductive slug
Inventors:
Michael J. Hundt, Anthony M. Chiu
Patented Case
View Patent ↗
Granted: Sep 5, 2000
Filed: Jun 17, 1998
Inventors
Michael J. Hundt
Anthony M. Chiu
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.