Granted Patent
Utility
US 6,114,245 · App. 09/356,616
Method of processing semiconductor wafers
Inventors:
Roland R. Vandamme, Yun-Biao Xin, Zhijian Pei
Patented Case
View Patent ↗
Granted: Sep 5, 2000
Filed: Jul 19, 1999
Inventors
Roland R. Vandamme
Yun-Biao Xin
Zhijian Pei
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.