Granted Patent
Utility
US 6,121,678 · App. 08/994,741
Wrap-around interconnect for fine pitch ball grid array
Inventors:
Anthony M. Chiu, Tom Lao, Harry Michael Siegel, Michael J. Hundt
Patented Case
View Patent ↗
Granted: Sep 19, 2000
Filed: Dec 19, 1997
Inventors
Anthony M. Chiu
Tom Lao
Harry Michael Siegel
Michael J. Hundt
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.