Granted Patent
Utility
US 6,127,203 · App. 09/304,953
Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion
Inventors:
Chang-Feng Wan, Richard Scott List, Curtis Gene Garrett, Dwight U. Bartholomew
Patented Case
View Patent ↗
Granted: Oct 3, 2000
Filed: May 5, 1999
Inventors
Chang-Feng Wan
Richard Scott List
Curtis Gene Garrett
Dwight U. Bartholomew
Assignee (at issue)
DRS Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.