Granted Patent
Utility
US 6,136,707 · App. 09/410,898
Seed layers for interconnects and methods for fabricating such seed layers
Inventor:
Uri Cohen
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Oct 2, 1999
Inventor
Uri Cohen
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.