Granted Patent
Utility
US 6,137,184 · App. 09/067,421
Flip-chip type semiconductor device having recessed-protruded electrodes in press-fit contact
Inventor:
Gorou Ikegami
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Apr 28, 1998
Inventor
Gorou Ikegami
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.