Granted Patent
Utility
US 6,137,298 · App. 08/986,374
Method and apparatus for clamping land grid array integrated circuit devices
Inventor:
Byron Binns
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Dec 5, 1997
Inventor
Byron Binns
Assignee (at issue)
Compaq Computer Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.