IP Library › Granted Patent US 6,150,916
Granted Patent Utility
US 6,150,916 · App. 09/149,929

Architecture of poly fuses

Inventors: Jy-Hwang Lin, Tsan-Wen Liu
Patented Case View Patent ↗
Granted: Nov 21, 2000 Filed: Sep 9, 1998
Inventors
Jy-Hwang Lin
Tsan-Wen Liu
Assignee (at issue)
WINBOND ELECTRONICS CORP.

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Quick Facts
Patent No.
US 6,150,916
App. No.
09/149,929
Filed
1998-09-09
Granted
2000-11-21
Kind
A