Granted Patent
Utility
US 6,156,676 · App. 09/122,335
Laser marking of semiconductor wafer substrate while inhibiting adherence to substrate surface of particles generated during laser marking
Inventors:
Nobuyoshi Sato, Hiroshi Ohsawa, Hitoshi Hasegawa
Patented Case
View Patent ↗
Granted: Dec 5, 2000
Filed: Jul 24, 1998
Inventors
Nobuyoshi Sato
Hiroshi Ohsawa
Hitoshi Hasegawa
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.