Granted Patent
Utility
US 6,159,327 · App. 09/075,088
Apparatus and method for applying heat bondable lamina to a substrate
Inventor:
Maurice J. Forkert
Patented Case
View Patent ↗
Granted: Dec 12, 2000
Filed: May 8, 1998
Inventor
Maurice J. Forkert
Assignee (at issue)
Polaroid Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.