Granted Patent
Utility
US 6,164,133 · App. 09/146,434
Method and apparatus for pre-processing of semiconductor substrate surface analysis
Inventor:
Kaori Watanabe
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Sep 3, 1998
Inventor
Kaori Watanabe
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.