Granted Patent
Utility
US 6,165,232 · App. 09/156,961
Method and apparatus for securely holding a substrate during dicing
Inventors:
Alois Tieber, Kiyoteru Saiki
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Sep 18, 1998
Inventors
Alois Tieber
Kiyoteru Saiki
Assignees (at issue)
TOWA CORPORATION
Intercon Tools, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.