Granted Patent
Utility
US 6,184,570 · App. 09/428,861
Integrated circuit dies including thermal stress reducing grooves and microelectronic packages utilizing the same
Inventors:
James D. MacDonald, Jr., Rahul Gupta
Patented Case
View Patent ↗
Granted: Feb 6, 2001
Filed: Oct 28, 1999
Inventors
James D. MacDonald, Jr.
Rahul Gupta
Assignee (at issue)
ERICSSON GMBH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.