Granted Patent
Utility
US 6,191,484 · App. 08/508,973
Method of forming planarized multilevel metallization in an integrated circuit
Inventors:
Kuei-Wu Huang, Tsiu C. Chan, Jamin Ling
Patented Case
View Patent ↗
Granted: Feb 20, 2001
Filed: Jul 28, 1995
Inventors
Kuei-Wu Huang
Tsiu C. Chan
Jamin Ling
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.