Granted Patent
Utility
US 6,194,772 · App. 09/310,241
High-voltage semiconductor device with trench structure
Inventor:
Ming-Tsung Tung
Patented Case
View Patent ↗
Granted: Feb 27, 2001
Filed: May 12, 1999
Inventor
Ming-Tsung Tung
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.