Granted Patent
Utility
US 6,210,257 · App. 09/087,420
Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
Inventor:
David W. Carlson
Patented Case
View Patent ↗
Granted: Apr 3, 2001
Filed: May 29, 1998
Inventor
David W. Carlson
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.