Granted Patent
Utility
US 6,214,131 · App. 09/182,938
Mixed solder pastes for low-temperature soldering process
Inventor:
Fay Hua
Patented Case
View Patent ↗
Granted: Apr 10, 2001
Filed: Oct 29, 1998
Inventor
Fay Hua
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.