Granted Patent
Utility
US 6,218,734 · App. 09/247,650
Copper adhered to a diffusion barrier surface
Inventors:
Lawrence J. Charneski, Tue Nguyen
Patented Case
View Patent ↗
Granted: Apr 17, 2001
Filed: Feb 9, 1999
Inventors
Lawrence J. Charneski
Tue Nguyen
Assignees (at issue)
Sharp Laboratories of America, Inc.
SHARP KABUSHIKI KAISHA
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.