IP Library › Granted Patent US 6,231,428
Granted Patent Utility
US 6,231,428 · App. 09/261,112

Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring

Inventors: Gerard S. Maloney, Scott Chin, John Geraghty, William Dyson, Jr., Tanlin Dickey
Patented Case View Patent ↗
Granted: May 15, 2001 Filed: Mar 3, 1999
Inventors
Gerard S. Maloney
Scott Chin
John Geraghty
William Dyson, Jr.
Tanlin Dickey
Assignee (at issue)
MITSUBISHI MATERIALS CORPORATION

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Quick Facts
Patent No.
US 6,231,428
App. No.
09/261,112
Filed
1999-03-03
Granted
2001-05-15
Kind
A