Granted Patent
Utility
US 6,232,212 · App. 09/256,443
Flip chip bump bonding
Inventors:
Yinon Degani, Dean Paul Kossives
Patented Case
View Patent ↗
Granted: May 15, 2001
Filed: Feb 23, 1999
Inventors
Yinon Degani
Dean Paul Kossives
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.