Granted Patent
Utility
US 6,232,213 · App. 08/910,500
Method of making a semiconductor chip package
Inventors:
Jerrold L. King, Jerry M. Brooks
Patented Case
View Patent ↗
Granted: May 15, 2001
Filed: Aug 4, 1997
Inventors
Jerrold L. King
Jerry M. Brooks
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.