Granted Patent
Utility
US 6,232,214 · App. 09/316,475
Method for fabricating inter-metal dielectric layer
Inventors:
Claymens Lee, Gary Hong
Patented Case
View Patent ↗
Granted: May 15, 2001
Filed: May 21, 1999
Inventors
Claymens Lee
Gary Hong
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.