Granted Patent
Utility
US 6,241,915 · App. 09/392,073
Epoxy, epoxy system, and method of forming a conductive adhesive connection
Inventors:
Rickie C. Lake, Krishna Kumar
Patented Case
View Patent ↗
Granted: Jun 5, 2001
Filed: Sep 8, 1999
Inventors
Rickie C. Lake
Krishna Kumar
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.