Granted Patent
Utility
US 6,242,078 · App. 09/123,952
High density printed circuit substrate and method of fabrication
Inventors:
Richard J. Pommer, Jeffrey T. Gotro, Nancy Androff, Marc Hein, Corey Zarecki
Patented Case
View Patent ↗
Granted: Jun 5, 2001
Filed: Jul 28, 1998
Inventors
Richard J. Pommer
Jeffrey T. Gotro
Nancy Androff
Marc Hein
Corey Zarecki
Assignee (at issue)
Isola Laminate Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.