Granted Patent
Utility
US 6,242,814 · App. 09/127,486
Universal I/O pad structure for in-line or staggered wire bonding or arrayed flip-chip assembly
Inventor:
Stephen J. Bassett
Patented Case
View Patent ↗
Granted: Jun 5, 2001
Filed: Jul 31, 1998
Inventor
Stephen J. Bassett
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.