IP Library Granted Patent US 6,246,118
Granted Patent Utility
US 6,246,118 · App. 09/252,185

Low dielectric semiconductor device with rigid, conductively lined interconnection system

Inventor: Matthew S. Buynoski
Patented Case View Patent ↗
Granted: Jun 12, 2001 Filed: Feb 18, 1999
Inventor
Matthew S. Buynoski
Assignee (at issue)
Advanced Micro Devices, Inc.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,246,118
App. No.
09/252,185
Filed
1999-02-18
Granted
2001-06-12
Kind
A