Granted Patent
Utility
US 6,257,954 · App. 09/511,030
Apparatus and process for high temperature wafer edge polishing
Inventors:
Kan-Yin Ng, Robert J. Walsh, Henry F. Erk, Dennis Buese
Patented Case
View Patent ↗
Granted: Jul 10, 2001
Filed: Feb 23, 2000
Inventors
Kan-Yin Ng
Robert J. Walsh
Henry F. Erk
Dennis Buese
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.