IP Library › Granted Patent US 6,268,241
Granted Patent Utility
US 6,268,241 · App. 09/408,152

Method of forming a self-aligned silicide structure in integrated circuit fabrication

Inventors: Hwi-Huang Chen, Gary Hong
Patented Case View Patent ↗
Granted: Jul 31, 2001 Filed: Sep 29, 1999
Inventors
Hwi-Huang Chen
Gary Hong
Assignee (at issue)
WINBOND ELECTRONICS CORP.

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Quick Facts
Patent No.
US 6,268,241
App. No.
09/408,152
Filed
1999-09-29
Granted
2001-07-31
Kind
A