Granted Patent
Utility
US 6,268,654 · App. 09/437,574
Integrated circuit package having adhesive bead supporting planar lid above planar substrate
Inventors:
Thomas P. Glenn, Roy Dale Hollaway, Anthony E. Panczak
Patented Case
View Patent ↗
Granted: Jul 31, 2001
Filed: Nov 9, 1999
Inventors
Thomas P. Glenn
Roy Dale Hollaway
Anthony E. Panczak
Assignee (at issue)
Ankor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.