Granted Patent
Utility
US 6,271,481 · App. 09/146,514
Pad configurations for improved etching of multilayer circuit assemblies
Inventors:
Lakhi Nandlal Goenka, Jay DeAvis Baker
Patented Case
View Patent ↗
Granted: Aug 7, 2001
Filed: Sep 3, 1998
Inventors
Lakhi Nandlal Goenka
Jay DeAvis Baker
Assignee (at issue)
Visteon Global Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.