Granted Patent
Utility
US 6,271,585 · App. 09/110,669
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
Inventors:
Mitsuo Osada, Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa
Patented Case
View Patent ↗
Granted: Aug 7, 2001
Filed: Jul 7, 1998
Inventors
Mitsuo Osada
Akira Ichida
Norio Hirayama
Kiyoshi Asai
Hidetoshi Maesato
Tadashi Arikawa
Assignee (at issue)
Tokyo Tungsten Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.