Granted Patent
Utility
US 6,293,457 · App. 09/590,119
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization
Inventors:
Kamalesh K. Srivastava, Jonathan H. Griffith, Mary Cullinan-Scholl, William Brearley, Peter C. Wade
Patented Case
View Patent ↗
Granted: Sep 25, 2001
Filed: Jun 8, 2000
Inventors
Kamalesh K. Srivastava
Jonathan H. Griffith
Mary Cullinan-Scholl
William Brearley
Peter C. Wade
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.