Granted Patent
Utility
US 6,297,155 · App. 09/305,093
Method for forming a copper layer over a semiconductor wafer
Inventors:
Cindy Reidsema Simpson, Robert D. Mikkola, Matthew T. Herrick, Brett Baker, David Moralez Pena, Edward Acosta, Rina Chowdhury, Marijean E. Azrak, Cindy Goldberg, Mohammed Rabiul Islam
Patented Case
View Patent ↗
Granted: Oct 2, 2001
Filed: May 3, 1999
Inventors
Cindy Reidsema Simpson
Robert D. Mikkola
Matthew T. Herrick
Brett Baker
David Moralez Pena
Edward Acosta
Rina Chowdhury
Marijean E. Azrak
Cindy Goldberg
Mohammed Rabiul Islam
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.