IP Library › Granted Patent US 6,300,688
Granted Patent Utility
US 6,300,688 · App. 08/350,865

Bond pad having vias usable with antifuse process technology

Inventor: Richard J. Wong
Patented Case View Patent ↗
Granted: Oct 9, 2001 Filed: Dec 7, 1994
Inventor
Richard J. Wong
Assignee (at issue)
QuickLogic Corporation

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,300,688
App. No.
08/350,865
Filed
1994-12-07
Granted
2001-10-09
Kind
A