IP Library Granted Patent US 6,303,043
Granted Patent Utility
US 6,303,043 · App. 09/348,407

Method of fabricating preserve layer

Inventors: Wei-Shiau Chen, Ruoh-Haw Chang, Shu-Jen Chen
Patented Case View Patent ↗
Granted: Oct 16, 2001 Filed: Jul 7, 1999
Inventors
Wei-Shiau Chen
Ruoh-Haw Chang
Shu-Jen Chen
Assignee (at issue)
WINBOND ELECTRONICS CORP.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,303,043
App. No.
09/348,407
Filed
1999-07-07
Granted
2001-10-16
Kind
A