Granted Patent
Utility
US 6,304,450 · App. 09/353,428
Inter-circuit encapsulated packaging
Inventors:
Joseph T. DiBene, II, David Hartke
Patented Case
View Patent ↗
Granted: Oct 16, 2001
Filed: Jul 15, 1999
Inventors
Joseph T. DiBene, II
David Hartke
Assignee (at issue)
Incep Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.