Granted Patent
Utility
US 6,306,762 · App. 08/760,557
Semiconductor device having multi-layered metalization and method of manufacturing the same
Inventors:
Makiko Nakamura, Yasuhiro Fukuda, Yasuyuki Tatara, Yusuke Harada, Hiroshi Onoda
Patented Case
View Patent ↗
Granted: Oct 23, 2001
Filed: Dec 4, 1996
Inventors
Makiko Nakamura
Yasuhiro Fukuda
Yasuyuki Tatara
Yusuke Harada
Hiroshi Onoda
Assignee (at issue)
Electric Industry Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.